Engr. Punzalan developed his career in Semiconductor Packaging, starting as an Assembly engineer at Analog Devices from 1994 to 2000 to Package Innovation in 2000 where he interfaced with ADI product line, test engineers, reliability/failure analysis engineers, suppliers, and subcontractor’s package development.
He has been teaching Engineering Economics, Management, Operations, Statistics at De La Salle School of Engineering from 2009 up to the present.
He became the Package Innovation Director at NXP Semiconductors Cabuyao, Inc. and was responsible for the Leads Package Innovation department which introduces new products, new packages, new materials, and breakthrough processes in APP for RF Power and Automotive packages. He supports the business lines of RF Power, Sensors, and PowerMos in the generation of package, material, and process roadmaps. He was an APP representative in NXP’s central working teams.
Currently the New Technology Introduction Director at Ampelon Philippines, Inc., he is responsible for the GaN Program and Leads Package Innovation department which provide breakthrough processes in APP for RF Power and Automotive packages. He utilized his knowledge of metallurgy in understanding the infraction of assembly process and materials resulting in the design of packages that are reliable and easy to manufacture.
He is also a staunch advocate of developing Filipino engineering in this field.